1.5KE500C中文資料碩凱電子數(shù)據(jù)手冊PDF規(guī)格書

Features

? Glass passivated chip junction in DO-15 Package

? Low leakage

? Uni and Bidirectional unit

? Excellent clamping capability

? 600W Peak power capability at 10 × 1000μs waveform Repetition rate (duty cycle):0.01

? Fast response time: typically less than 1.0ps from 0 Volts to VBR min

? Typical IR less than 5μA above 12V.

? High Temperature soldering: 260°C/40 seconds at terminals

? Typical maximum temperature coefficient ΔVBR = 0.1 × VBR@25°C× ΔT

? Plastic package has Underwriters Laboratory Flammability 94V-0

? Matte tin lead–free Plated

? Halogen free and RoHS compliant

? Typical failure mode is short from over-specified voltage or current

? Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c

? IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)

? ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2)

? EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4)