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3.0SMBJ33CA-HF中文資料典琦數據手冊PDF規(guī)格書
3.0SMBJ33CA-HF規(guī)格書詳情
Features
- Glass passivated chip.
- Low leakage.
- Built-in strain relief.
- Low inductance.
- 3000W peak pulse power capability with a 10/1000μs
waveform, repetition rate (duty cycles): 0.01%.
- Excellent clamping capability.
- High temperature soldering:
260°C/40 seconds at terminals.
- Matte tin lead-free plated.
- Bidirectional unit.
- Very fast response time.
- IEC-61000-4-2 ESD 30kV (Air), 30kV (Contact).
- Typical maximum temperature coefficient
△VBR=0.1%xVBR@25°Cx△T
