5.0SMDJ19C中文資料優(yōu)恩半導體數(shù)據(jù)手冊PDF規(guī)格書

For surface mounted applications in order to optimize board space

Low leakage

Uni and Bidirectional unit

Glass passivated junction

Low inductance

Excellent clamping capability

5000W Peak power capability at 10 × 1000μs waveform Repetition

rate (duty cycle):0.01

Fast response time: typically less than 1.0ps from 0 Volts to VBR min

Typical IR less than 5μA above 19V.

High Temperature soldering: 260°C/40 seconds at terminals

Typical maximum temperature coefficient ΔVBR = 0.1 ×VBR@25°C× ΔT

Plastic package has Underwriters Laboratory Flammability 94V-0

Matte tin lead–free Plated

Halogen free and RoHS compliant

Typical failure mode is short from over-specified voltage or current

Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c

IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)

ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2)

EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4)

Features