A22AP-JA中文資料恩楷楷數(shù)據(jù)手冊PDF規(guī)格書

Distinctive Characteristics

Subminiature size saves space on PC boards.

Specifically developed for logic-level applications.

Totally sealed body construction prevents contact contamination and allows time- and money-saving automated soldering and cleaning.

Award-winning STC contact mechanism with benefits unavailable in conventional mechanisms: smoother, positive detent actuation, increased contact stability and unparalleled logic-level reliability. (Additional STC details in Terms & Acronyms; see Supplement contents.)

Molded-in, epoxy sealed or ultrasonically welded terminals lock out flux, solvents, and other contaminants.

.100” x .100” (2.54mm x 2.54mm) terminal spacing conforms to standard PC board grid spacing.

Toggle option in antistatic material available for dissipating electrostatic discharges.

Matching indicators available and shown at the end of Section M.