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CDBP0130R

SMDSchottkyBarrlierDiode

IO=100mA VR=30V RoHSDevice Features -Smallsurfacemountingtype. -Lowreversecurrentandlowforwardvoltage. -Highreliability. MechanicalData -Case:MoldedplasticSOD-723 -Terminals:SolderableperMIL-STD-750,Method2026.1. -Polarity:Indicatedbycathodeband. -Mountin

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBP0130R-G

SMDSchottkyBarrierDiode

ReverseVoltage:30Volts ForwardCurrent:100mA Features: ?SmallSurfaceMountingType ?LowReverseCurrentandLowForwardVoltage. ?HighReliability MechanicalData: ?Case:MoldedplasticSOD-723 ?Terminals:SolderableperMIL-STD-750,Method2026.1. ?Polarity:Indicatedbycath

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQC0130L-HF

LowVFSMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQC0130R-HF

SMDSchottkyBarrierDiode

Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR0130L

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR0130L-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR0130R

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Lowreversecurrent Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-ST

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR0130R-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBS0130

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBS0130

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method202

COMCHIPComchip Technology

典琦典琦科技股份有限公司

供應(yīng)商型號品牌批號封裝庫存備注價格
N/A
2447
SMD
100500
一級代理專營品牌!原裝正品,優(yōu)勢現(xiàn)貨,長期排單到貨
 詢價
2000
50
詢價
TI/德州儀器
23+
HTSSOP48
50000
全新原裝正品現(xiàn)貨,支持訂貨
 詢價
TI/德州儀器
23+
HTSSOP48
10880
原裝正品，支持實單
 詢價
TI(德州儀器)
24+
NA/
7350
現(xiàn)貨供應(yīng),當(dāng)天可交貨!免費送樣,原廠技術(shù)支持!!!
 詢價
TI/德州儀器
24+
NA/
133
優(yōu)勢代理渠道,原裝正品,可全系列訂貨開增值稅票
 詢價
50
23+
原廠正規(guī)渠道
5000
專注配單,只做原裝進口現(xiàn)貨
 詢價
50
23+
原廠正規(guī)渠道
5000
專注配單,只做原裝進口現(xiàn)貨
 詢價
TI
25+
HTSSOP48
138
原裝正品,假一罰十!
 詢價
恩XP
24+
SOT-23
6000
公司現(xiàn)貨庫存,支持實單
 詢價
更多BURNDY_YF0130ID供應(yīng)商 更新時間2025-7-9 15:01:00

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