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C0402C0G1C0R6B

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化(中國)投資有限公司

C0402C0G1C0R6B

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化(中國)投資有限公司

C0402C0G1C0R6B

CSeriesGeneralApplication

TDKTDK Corporation

TDK株式會社東電化(中國)投資有限公司

C0402C0G1C0R6W

CSeriesGeneralApplication

TDKTDK Corporation

TDK株式會社東電化(中國)投資有限公司

C0402C0G1C0R6W

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化(中國)投資有限公司

C0402C0G1C0R6W

MULTILAYERCERAMICCHIPCAPACITORS

Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式會社東電化(中國)投資有限公司

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