VESD05A1A-HD1_V01中文資料威世科技數(shù)據(jù)手冊PDF規(guī)格書

FEATURES

? Ultra compact LLP1006-2L package

? Low package height < 0.4 mm

? 1-line ESD protection

? Low leakage current < 1 μA

? Low load capacitance CD = 76 pF?

(VR = 2.5 V; f = 1 MHz)

? ESD immunity acc. IEC 61000-4-2?

± 30 kV contact discharge?

± 30 kV air discharge

? High surge current acc. IEC 61000-4-5 IPP > 16 A

? Soldering can be checked by standard vision inspection.

No X-ray necessary

? Pin plating NiPdAu (e4) no whisker growth

? e4 - precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn)

? PATENT(S): www.vishay.com/patents

? Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912?