ZP107

ZP系列 Mini PCIE模組;

東芯通信ZP系列LTE Mini PCIe模組基于公司自主研發(fā)的第二代LTE基帶芯片XIN100R2，通過搭載不同的射頻電路，能夠支持1.4G和1.8G專網(wǎng)頻段和LTE公網(wǎng)頻段。LTE Mini PCIe模組可以通過標準mini PCIe接口內(nèi)嵌到各種移動設(shè)備，或者通過（測試母板）USB接口連接至PC機、筆記本等其他設(shè)備，為用戶提供高速高性能的移動數(shù)據(jù)業(yè)務(wù)體驗。模組基帶芯片還實現(xiàn)了中國自主制定的基于TD-LTE技術(shù)的專網(wǎng)寬帶集群通信標準（B-TrunC），可以支持多種特定應(yīng)用。

ETC

ZP1075

SURGE PROTECTIVE DEVICES

107

PrecisionWirewoundResistors

100Series/SMSeries/PCSeries ?Resistancesto6Megohms ?ResistanceTolerancesto±0.005 ?TemperatureCoeffcientsof±2ppm/°C ?HighTCRAvailable(Balco&PlatinumWire) ?100AcceptanceTested/TraceabletoNIST ?LongTermStability/100ppm/year ?MatchedResistanceSetst

107

PrecisionWirewoundResistors

107

Smooth,hightorque,rollerratchethandle

107

CustomerSpecification

Construction Diameters(In) 1)Component13X1COND a)Conductor18(41/34)AWGBareCopper0.043 b)Insulation0.010Wall,Nom.PVC,SemiRigid0.063 (1)Color(s) CondColorCondColorCondColor 1BROWN2BLUE3BLACK 2)CableAssembly3ComponentsCabled a)Twists:6.0Twists/foot(m

107

CustomerSpecification

Construction Diameters(In) 1)Component13X1COND a)Conductor18(41/34)AWGBareCopper0.043 b)Insulation0.010Wall,Nom.PVC,SemiRigid0.063 (1)Color(s) CondColorCondColorCondColor 1BROWN2BLUE3BLACK 2)CableAssembly3ComponentsCabled a)Twists:6.0Twists/foot(m

107

Rack&Panel

107

107/207,108/208In-LineDiaphragmSeals

FEATURES ?316LStainlesssteeltophousing(standard) ?Availablewithdiaphragmweldedorbondedtotophousingorremovablethreadedcapsulediaphragms ?Flowthroughdesignreducesthepossibilityofclogging ?Large21/2?diaphragmcompatiblewithmostAshcroftinstrumentation

107

TemperatureProbe

BenefitsandFeatures Versatileproduct—measuresair,soil,orwatertemperature Easytoinstallorremove Durable CompatiblewithAM16/32-seriesmultiplexers,allowingmeasurementofmultiplesensors TechnicalDescription The107consistsofathermistorencapsulatedinanepoxy-filled