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Marking:75R008M1;Package:PG-HDSOP-22;CoolSiCa Power Device 750 V G1 Features ?Highlyrobust750Vtechnology,100%avalanchetested ?Best-in-classRDS(on)xQfr ?ExcellentRDS(on)xQossandRDS(on)xQG ?UniquecombinationoflowCrss/CissandhighVGS(th) ?Infineonproprietarydieattachtechnology ?Cuttingedgetopsidecoolingpackage(QDPAK) ? | InfineonInfineon Technologies AG 英飛凌英飛凌科技股份公司 | Infineon | ||
Marking:75R008M1;Package:PG-TO247-4;CoolSiC? M1 CoolSiC? Power Device 750 V G1 Features ?Highlyrobust750Vtechnology,100%avalanchetested ?Best?in?classRDS(on)xQfr ?ExcellentRDS(on)xQossandRDS(on)xQG ?UniquecombinationoflowCrss/CissandhighVGS(th) ?Infineonproprietarydieattachtechnology ?Driversourcepinavailable ?Best?in?classRDS | InfineonInfineon Technologies AG 英飛凌英飛凌科技股份公司 | Infineon |
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